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Water Vapor Plasma Bonding for Ultrathin and Flexible Electronics
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Water Vapor Plasma Bonding for Ultrathin and Flexible Electronics

JANUARY 11TH, 2022   CONN HASTINGS  MATERIALS Scientists at RIKEN research institute in Japan have developed a new method to bind gold electrodes to each other within flexible electronics. The technique, which does not require adhesives or high temperatures that can damage delicate electronic components, allows for extremely thin and flexible electronics and could lead to new types...